SN74LVT16952DL 供应商
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SN74LVT16952DL
品牌：TI 封装/批号：原厂原装/22+ -
SN74LVT16952DL
品牌：TI(德州仪器) 封装/批号：SSOP-56/2022+ -
SN74LVT16952DLR
品牌：TI 封装/批号：TSSOP/23+
SN74LVT16952DL 属性参数
- 标准包装：20
- 类别：集成电路 (IC)
- 家庭：逻辑 - 缓冲器，驱动器，接收器，收发器
- 系列：74LVT
- 逻辑类型：寄存收发器，非反相
- 元件数：2
- 每个元件的位元数：8
- 输出电流高，低：32mA，64mA
- 电源电压：2.7 V ~ 3.6 V
- 工作温度：-40°C ~ 85°C
- 安装类型：表面贴装
- 封装/外壳：56-BSSOP（0.295"，7.50mm 宽）
- 供应商设备封装：56-SSOP
- 包装：管件
- 其它名称：296-1254-5296-1705
产品特性
- State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
- Members of the Texas Instruments WidebusTM Family
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Support Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
- Support Live Insertion
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings Widebus is a trademark of Texas Instruments Incorporated.
产品概述
The 'LVT16952 are 16-bit registered transceivers designed for
low-voltage (3.3-V) VCC operation, but with the capability
to provide a TTL interface to a 5-V system environment. These devices
can be used as two 8-bit transceivers or one 16-bit transceiver. Data
on the A or B bus is stored in the registers on the low-to-high
transition of the clock (CLKAB or CLKBA) input provided that the
clock-enable (or ) input is low. Taking the
output-enable ( or ) input low accesses the data on
either port.Active bus-hold circuitry is provided to hold unused or floating
data inputs at a valid logic level.To ensure the high-impedance state during power up or power down,
should be tied
to VCC through a pullup resistor; the minimum value of the
resistor is determined by the current-sinking capability of the
driver.The SN74LVT16952 is available in TI's shrink small-outline (DL)
and thin shrink small-outline (DGG) packages, which provide twice the
I/O pin count and functionality of standard small-outline packages in
the same printed-circuit-board area. The SN54LVT16952 is characterized for operation over the full
military temperature range of -55°C to 125°C. The
SN74LVT16952 is characterized for operation from -40°C to
85°C.
SN74LVT16952DL