IC元器件

SN74AUP3G17DCUR

Texas Instruments 逻辑 - 缓冲器，驱动器，接收器，收发器

SN74AUP3G17DCUR 供应商

SN74AUP3G17DCUR 属性参数

  • 标准包装：1
  • 类别：集成电路 (IC)
  • 家庭：逻辑 - 缓冲器，驱动器，接收器，收发器
  • 系列：74AUP
  • 逻辑类型：施密特触发器 - 缓冲器，驱动器
  • 元件数：3
  • 每个元件的位元数：1
  • 输出电流高，低：4mA，4mA
  • 电源电压：0.8 V ~ 3.6 V
  • 工作温度：-40°C ~ 85°C
  • 安装类型：表面贴装
  • 封装/外壳：8-VFSOP（0.091"，2.30mm 宽）
  • 供应商设备封装：US8
  • 包装：®
  • 其它名称：296-25596-6

产品特性

  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise — Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101)
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

产品概述

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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