SN74AUP2G126YZPR 供应商
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SN74AUP2G126YZPR
品牌：TI 封装/批号：原厂原装/22+ -
SN74AUP2G126YZPR
品牌：TI(德州仪器) 封装/批号：DSBGA-8/2022+
SN74AUP2G126YZPR 属性参数
- 标准包装：1
- 类别：集成电路 (IC)
- 家庭：逻辑 - 缓冲器，驱动器，接收器，收发器
- 系列：74AUP
- 逻辑类型：缓冲器/线路驱动器，非反相
- 元件数：2
- 每个元件的位元数：1
- 输出电流高，低：4mA，4mA
- 电源电压：0.8 V ~ 3.6 V
- 工作温度：-40°C ~ 85°C
- 安装类型：表面贴装
- 封装/外壳：8-XFBGA，DSBGA
- 供应商设备封装：8-DSBGA，8-WCSP（1.9x0.9）
- 包装：®
- 其它名称：296-24738-6
产品特性
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption (ICC = 0.9 µA Max)
- Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typ)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Input-Disable Feature Allows Floating Input Conditions
- Ioff Supports Partial-Power-Down Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 9.9 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
产品概述
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
SN74AUP2G126YZPR