TWL1200YFFR 供应商
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TWL1200YFFR
品牌：TI 封装/批号：原厂原装/22+ -
TWL1200YFFR
品牌：TI 封装/批号：BGA/新批号 -
TWL1200YFFR
品牌：TI 封装/批号：TSSOP/23+
TWL1200YFFR 属性参数
- 标准包装：1
- 类别：集成电路 (IC)
- 家庭：逻辑 - 变换器
- 系列：-
- 逻辑功能：变换器
- 位数：19
- 输入类型：电压
- 输出类型：电压
- 数据速率：60Mbps
- 通道数：19
- 输出/通道数目：1
- 差分 - 输入:输出：无/无
- 传输延迟（最大）：7ns
- 电源电压：1.1 V ~ 3.6 V
- 工作温度：-40°C ~ 85°C
- 封装/外壳：49-UFBGA，DSBGA
- 供应商设备封装：49-DSBGA（3x3）
- 包装：®
- 其它名称：296-25457-6
产品特性
- Level Translator VCCA and VCCB Range of 1.1 V to 3.6 V
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Seamlessly Bridges 1.8-V/2.6-V Digital-Switching Compatibility Gap Between 2.6-V processors and TI’s Wi-Link (WL1271 and WL1273)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22 2500-V Human-Body Model (A114-B) 250-V Machine Model (A115-A) 1500-V Charged-Device Model (C101)
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
产品概述
The TWL1200 is an 19-bit voltage translator specifically designed to seamlessly bridge the
The TWL1200 is offered in both 48-ball 0.5-mm ball grid array (BGA) and 49-bump 0.4-mm wafer chip scale package (WCSP) packages. Low static power consumption and small package size make the TWL1200 an ideal choice for mobile-phone applications.
TWL1200YFFR