IC元器件

TLV2342IP 供应商

TLV2342IP 属性参数

  • 标准包装:50
  • 类别:集成电路 (IC)
  • 家庭:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
  • 系列:LinCMOS™
  • 放大器类型:通用
  • 电路数:2
  • 输出类型:-
  • 转换速率:3.6 V/µs
  • 增益带宽积:1.7MHz
  • -3db带宽:-
  • 电流 - 输入偏压:0.6pA
  • 电压 - 输入偏移:1100µV
  • 电流 - 电源:1.4mA
  • 电流 - 输出 / 通道:30mA
  • 电压 - 电源,单路/双路(±):2 V ~ 8 V,±1 V ~ 4 V
  • 工作温度:-40°C ~ 85°C
  • 安装类型:通孔
  • 封装/外壳:8-DIP(0.300",7.62mm)
  • 供应商设备封装:8-PDIP
  • 包装:管件
  • 其它名称:296-7474-5

产品特性

  • Wide Range of Supply Voltages Over Specified Temperature Range:
  • -40°C to 85°C...2 V to 8 V
  • Fully Characterized at 3 V and 5 V
  • Single-Supply Operation
  • Common-Mode Input-Voltage Range Extends Below the Negative Rail and Up to VDD -1 V at 25°C
  • Output Voltage Range Includes Negative Rail
  • High Input Impedance...1012 Typical
  • ESD-Protection Circuitry
  • Designed-In Latch-Up Immunity

产品概述

The TLV234x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike other products in this family designed primarily to meet aggressive power consumption specifications, the TLV234x was developed to offer ac performance approaching that of a BiFET operational amplifier while operating from a single-supply rail. At 3 V, the TLV234x has a typical slew rate of 2.1 V/us and 790-kHz unity-gain bandwidth. Each amplifier is fully functional down to a minimum supply voltage of 2 V and is fully characterized, tested, and specified at both 3-V and 5-V power supplies over a temperature range of -40°C to 85°C. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail. Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low input bias currents. These parameters combined with good ac performance make the TLV234x effectual in applications such as high-frequency filters and wide-bandwidth sensors. To facilitate the design of small portable equipment, the TLV234x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical. The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV234x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-PRF-38535, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.