TLV2322IDR 供应商
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TLV2322IDR
品牌:TI 封装/批号:原厂原装/22+ -
TLV2322IDR
品牌:TI/德州仪器 封装/批号:21+/SOP8 -
TLV2322IDR
品牌:TI(德州仪器) 封装/批号:SOIC-8/2022+ -
TLV2322IDR
品牌:TI 封装/批号:SOP-8/23+ -
TLV2322IDR
品牌:TI 封装/批号:TSSOP/23+
TLV2322IDR 属性参数
- 标准包装:2,500
- 类别:集成电路 (IC)
- 家庭:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- 系列:LinCMOS™
- 放大器类型:通用
- 电路数:2
- 输出类型:-
- 转换速率:0.03 V/µs
- 增益带宽积:85kHz
- -3db带宽:-
- 电流 - 输入偏压:0.6pA
- 电压 - 输入偏移:1100µV
- 电流 - 电源:20µA
- 电流 - 输出 / 通道:30mA
- 电压 - 电源,单路/双路(±):2 V ~ 8 V,±1 V ~ 4 V
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 封装/外壳:8-SOIC(0.154",3.90mm 宽)
- 供应商设备封装:8-SOIC
- 包装:带卷 (TR)
产品特性
- Wide Range of Supply Voltages Over Specified Temperature Range:
- TA = -40°C to 85°C...2 V to 8 V
- Fully Characterized at 3 V and 5 V
- Single-Supply Operation
- Common-Mode Input Voltage Range Extends Below the Negative Rail and up to VDD -1 V at TA = 25°C
- Output Voltage Range Includes Negative Rail
- High Input Impedance...1012 Typical
- ESD-Protection Circuitry
- Designed-In Latch-Up Immunity
产品概述
The TLV232x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. This amplifier is especially well suited to ultra-low-power systems that require devices to consume the absolute minimum of supply currents. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail.
These amplifiers are specifically targeted for use in very low-power, portable, battery-driven applications with the maximum supply current per operational amplifier specified at only 27 uA over its full temperature range of -40°C to 85°C.
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.
To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD can result in the degradation of the device parametric performance.