TLV2231IDBVR 供应商
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TLV2231IDBVR
品牌:TI 封装/批号:原厂原装/22+ -
TLV2231IDBVR
品牌:TI/德州仪器 封装/批号:SOT23-5/2024 -
TLV2231IDBVR
品牌:TI(德州仪器) 封装/批号:SOT-23/2022+ -
TLV2231IDBVR
品牌: 封装/批号:/23+
TLV2231IDBVR 属性参数
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- 系列:LinCMOS™
- 放大器类型:通用
- 电路数:1
- 输出类型:满摆幅
- 转换速率:1.6 V/µs
- 增益带宽积:2MHz
- -3db带宽:-
- 电流 - 输入偏压:1pA
- 电压 - 输入偏移:710µV
- 电流 - 电源:850µA
- 电流 - 输出 / 通道:50mA
- 电压 - 电源,单路/双路(±):2.7 V ~ 10 V,±1.35 V ~ 5 V
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 封装/外壳:SC-74A,SOT-753
- 供应商设备封装:SOT-23-5
- 包装:®
- 其它名称:296-10505-6
产品特性
- Output Swing Includes Both Supply Rails
- Low Noise...15 nV/Hz\ Typ at f = 1 kHz
- Low Input Bias Current...1 pA Typ
- Fully Specified for Single-Supply 3-V and 5-V Operation
- Common-Mode Input Voltage Range Includes Negative Rail
- High Gain Bandwidth...2 MHz at VDD = 5 V With 600- Load
- High Slew Rate...1.6 V/us at VDD = 5 V
- Wide Supply Voltage Range 2.7 V to 10 V
- Macromodel Included
产品概述
The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of bandwidth and 1.6 V/us of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2231 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2231, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-
loads for telecom applications.
With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN- terminals are on the same end of the board for providing negative feedback. Finally, gain setting resistors and the decoupling capacitor are easily placed around the package.