PAL16L8AMJ 供应商
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PAL16L8AMJ
品牌: 封装/批号:/2 - 
									
PAL16L8AMJ
品牌:TI 封装/批号:TSSOP/23+ - 
									
PAL16L8AMJ/883
品牌:MMI 封装/批号:DIP/87+ - 
									
PAL16L8AMJ/883
品牌:MMI 封装/批号:/2019+ - 
									
PAL16L8AMJB
品牌:TI 封装/批号:CDIP20/新批号 - 
									
PAL16L8AMJB
品牌:MMI 封装/批号:DIP24/22+ 
PAL16L8AMJ 属性参数
- 现有数量:0现货10,001Factory
 - 价格:在售
 - 系列:*
 - 包装:管件
 - 产品状态:在售
 - Digi-Key Programmable:-
 - 可编程类型:-
 - 宏单元数:-
 - 电压 - 输入:-
 - 速度:-
 - 安装类型:-
 - 封装/外壳:-
 - 供应商器件封装:-
 
产品特性
- Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min
 - High-Speed, A Devices . . . 25 MHz Min
 - Half-Power, A-2 Devices . . . 16 MHz Min
 - Choice of Input/Output Configuration
 - Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
 
产品概述
												These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
 The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.
 The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.