1658871-1 供应商
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1658871-1
品牌:TE CONNECTIVITY 封装/批号:/
1658871-1 属性参数
- 数据列表:1658871
- RoHS指令信息:1658871-1 Statement of Compliance
- 3D 型号:1658871-1.pdf
- 标准包装:192
- 类别:连接器,互连式
- 家庭:可插式
- 系列:-
- 连接器类型:机架
- 连接器类型:XFP
- 位置数:-
- 安装类型:通孔,直角
- 端子:压配式
- 特点:EMI 屏蔽
- 触点表面涂层:-
- 触点涂层厚度:-
- 包装:托盘
- 配用:A97465DKR-ND - CONN XFP 30POS HI-SPEED 30AU SMDA97460DKR-ND - CONN XFP 30POS 15GOLD SMDA97465CT-ND - CONN XFP 30POS HI-SPEED 30AU SMDA97464CT-ND - CONN XFP 30POS 30GOLD SMDA97460CT-ND - CONN XFP 30POS 15GOLD SMDA97465TR-ND - CONN XFP 30POS HI-SPEED 30AU SMDA97464TR-ND - CONN XFP 30POS 30GOLD SMDA97460TR-ND - CONN XFP 30POS 15GOLD SMD
- 相关产品:A97542-ND - DUST CAP FOR XFP AND QSFPA97467-ND - HEAT SINK XFP NETWORK APPSA97466-ND - HEAT SINK XFP PCI APPLICATIONSA97463-ND - HEAT SINK XFP SAN APPLICATIONS